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Lam Research

LRCXsupplier

Lam Research is a leading supplier of wafer-fabrication etch and deposition equipment. Its dominance in high-aspect-ratio etch makes it essential for 3D NAND flash scaling and increasingly important for advanced-logic patterning at 3nm and below.

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產品與營收

產品營收佔比

營收結構 ($18.2B)

靜態數據（加載即時財務…）

Memory (48%)
Foundry / Logic (38%)
Customer Support (14%)

業務部門構成與主要客戶

產品詳情

Conductor Etch35%

High-aspect-ratio etch systems for 3D NAND and logic patterning

Dielectric Etch20%

Selective oxide and nitride etch for multi-patterning

Deposition (PECVD / ALD)25%

Thin-film deposition for advanced interconnects

Clean / Strip10%

Post-etch residue removal and wafer-cleaning systems

Customer Support & Services10%

Spares, upgrades, and reliant productivity solutions

供應鏈關係

主要客戶

Taiwan Semiconductor Manufacturing Company

Etch and deposition systems

影響: $4B+

Samsung Electronics

3D NAND etch equipment

影響: $3B+

SK Hynix

DRAM and NAND etch

影響: $2B+

Micron Technology

Etch and deposition

影響: $1.5B+

競爭對手

Applied Materials

Etch and deposition

影響: Primary competitor

宏觀與市場背景

반도체行業新聞

WFE(반도체 장비) 업사이클 + AI HBM 슈퍼사이클 진입

TSMC 가동률

92%+

HBM 수요 성장

+180% YoY

WFE 시장 규모

$105B (2026E)

리드타임 (장비)

18~24개월

近期催化劑

◆TSMC Q2 실적 (2026.04.17)◆NVIDIA GB300 양산 착수 발표◆AMAT/LRCX/KLAC 실적 시즌 (2026.05)

供應鏈問題

★ 기회HBM 식각 장비 점유율 확대
2026-04

SK하이닉스 HBM4 라인 증설에 Lam 식각 장비 독점 공급. HBM 관련 매출 2026FY 30% 이상 성장 전망.

⚡ 리스크中 선진 장비 수출통제 영향 확인
2026-02

중국향 매출 비중 26%로 하락 (전년 32%). 미국 수출통제 강화로 중국 매출 구조적 감소 불가피.

機構訊號

機構操作價值季度申報日期
BlackRockaccumulating$480M2024.062024-08-13↑
BlackRockaccumulating$190M2024.062024-08-13↑
BlackRockaccumulating$180M2024.062024-08-13↑
BlackRockaccumulating$28M2024.062024-08-13↑
BlackRockaccumulating$21M2024.062024-08-13↑
BlackRockaccumulating$339M2024.062024-08-13↑
BlackRockaccumulating$371M2024.062024-08-13↑
BlackRockaccumulating$5.0B2024.062024-08-13↑
BlackRockaccumulating$3.2B2024.062024-08-13↑
BlackRockaccumulating$278M2024.062024-08-13↑
BlackRockaccumulating$615M2024.062024-08-13↑
BlackRockaccumulating$243M2024.062024-08-13↑
BlackRockaccumulating$365M2024.062024-08-13↑
BlackRockaccumulating$23M2024.062024-08-13↑
BlackRockaccumulating$1.7B2024.062024-08-13↑
BlackRockaccumulating$79M2024.062024-08-13↑
BlackRockaccumulating$43M2024.062024-08-13↑
BlackRockaccumulating$333M2024.062024-08-13↑
BlackRockaccumulating$30M2024.062024-08-13↑
BlackRockreducing$7M2024.062024-08-13↓
BlackRockreducing$154K2024.062024-08-13↓
BlackRockaccumulating$243M2024.062024-08-13↑

機構持股狀況

13F基準 · Q4 2025
機構變動持股比例上季度持股數市值SEC
Vanguard維持2.80%—5.7M股$1,800M13F
Fidelity增持1.50%—3.0M股$950M13F
Wellington新建倉0.97%—2.0M股$620M13F
Artisan Partners新建倉0.59%—1.2M股$380M13F
追蹤機構合計持股比例: 5.86%合計市值: $3,750MSEC EDGAR 13F-HR基準 · 45天延遲披露

最新新聞

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AI 分析

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企業資訊

總部

Fremont, California, USA

成立時間

1980

員工人數

17,500+

新聞盲區評分

盲區評分74
低盲區高盲區

機構活動

74

媒體評分

28

連鎖位置

連鎖中的角色

late mover

典型延遲

2-5 trading days

Memory capex recovery (driven by HBM demand) flows to Lam's etch-heavy memory equipment business with a lag.

檢視完整連鎖分析

行業概況 — 반도체

行業新聞

WFE(반도체 장비) 업사이클 + AI HBM 슈퍼사이클 진입

TSMC 가동률

92%+

HBM 수요 성장

+180% YoY

WFE 시장 규모

$105B (2026E)

리드타임 (장비)

18~24개월

核心主題

  • •AI 가속기(H100/B200) 수요 공급 불균형 지속
  • •Gate-All-Around 공정 전환 → 장비 교체 사이클
  • •HBM3e/HBM4 양산 경쟁 — SK하이닉스·마이크론·삼성

近期催化劑

  • ◆TSMC Q2 실적 (2026.04.17)
  • ◆NVIDIA GB300 양산 착수 발표