Lam Research
LRCXsupplierLam Research is a leading supplier of wafer-fabrication etch and deposition equipment. Its dominance in high-aspect-ratio etch makes it essential for 3D NAND flash scaling and increasingly important for advanced-logic patterning at 3nm and below.
Produits et revenus
Part de revenus par produit
Répartition du chiffre d'affaires ($18.2B)
Données statiques (chargement des finances en temps réel…)
Composition des segments et principaux clients
Détails du produit
High-aspect-ratio etch systems for 3D NAND and logic patterning
Selective oxide and nitride etch for multi-patterning
Thin-film deposition for advanced interconnects
Post-etch residue removal and wafer-cleaning systems
Spares, upgrades, and reliant productivity solutions
Relations dans la chaîne d'approvisionnement
Clients clés
Contexte macro et de marché
WFE(반도체 장비) 업사이클 + AI HBM 슈퍼사이클 진입
TSMC 가동률
HBM 수요 성장
WFE 시장 규모
리드타임 (장비)
Prochains catalyseurs
Problèmes de chaîne d'approvisionnement
SK하이닉스 HBM4 라인 증설에 Lam 식각 장비 독점 공급. HBM 관련 매출 2026FY 30% 이상 성장 전망.
중국향 매출 비중 26%로 하락 (전년 32%). 미국 수출통제 강화로 중국 매출 구조적 감소 불가피.
Signaux institutionnels
| Institution | Action | Valeur | Trimestre | Date de dépôt |
|---|---|---|---|---|
| BlackRock | accumulating | $480M | 2024.06 | 2024-08-13↑ |
| BlackRock | accumulating | $190M | 2024.06 | 2024-08-13↑ |
| BlackRock | accumulating | $180M | 2024.06 | 2024-08-13↑ |
| BlackRock | accumulating | $28M | 2024.06 | 2024-08-13↑ |
| BlackRock | accumulating | $21M | 2024.06 | 2024-08-13↑ |
| BlackRock | accumulating | $339M | 2024.06 | 2024-08-13↑ |
| BlackRock | accumulating | $371M | 2024.06 | 2024-08-13↑ |
| BlackRock | accumulating | $5.0B | 2024.06 | 2024-08-13↑ |
| BlackRock | accumulating | $3.2B | 2024.06 | 2024-08-13↑ |
| BlackRock | accumulating | $278M | 2024.06 | 2024-08-13↑ |
| BlackRock | accumulating | $615M | 2024.06 | 2024-08-13↑ |
| BlackRock | accumulating | $243M | 2024.06 | 2024-08-13↑ |
| BlackRock | accumulating | $365M | 2024.06 | 2024-08-13↑ |
| BlackRock | accumulating | $23M | 2024.06 | 2024-08-13↑ |
| BlackRock | accumulating | $1.7B | 2024.06 | 2024-08-13↑ |
| BlackRock | accumulating | $79M | 2024.06 | 2024-08-13↑ |
| BlackRock | accumulating | $43M | 2024.06 | 2024-08-13↑ |
| BlackRock | accumulating | $333M | 2024.06 | 2024-08-13↑ |
| BlackRock | accumulating | $30M | 2024.06 | 2024-08-13↑ |
| BlackRock | reducing | $7M | 2024.06 | 2024-08-13↓ |
| BlackRock | reducing | $154K | 2024.06 | 2024-08-13↓ |
| BlackRock | accumulating | $243M | 2024.06 | 2024-08-13↑ |
Actionnariat institutionnel
Base 13F · Q4 2025| Institution | Variation | % de détention | Trim. préc. | Actions | Valeur | SEC |
|---|---|---|---|---|---|---|
| Vanguard | Maintenue | 2.80% | — | 5.7M actions | $1,800M | 13F |
| Fidelity | Augmentée | 1.50% | — | 3.0M actions | $950M | 13F |
| Wellington | Nouveau | 0.97% | — | 2.0M actions | $620M | 13F |
| Artisan Partners | Nouveau | 0.59% | — | 1.2M actions | $380M | 13F |
Actualités récentes
Analyse IA
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Informations sur l'entreprise
Score d'écart médiatique
Activité institutionnelle
74
Score médiatique
28
Position dans la cascade
Rôle dans la cascade
late mover
Délai typique
2-5 trading days
Memory capex recovery (driven by HBM demand) flows to Lam's etch-heavy memory equipment business with a lag.
Voir la cascade complèteAperçu du secteur — 반도체
Actualités du secteurWFE(반도체 장비) 업사이클 + AI HBM 슈퍼사이클 진입
TSMC 가동률
HBM 수요 성장
WFE 시장 규모
리드타임 (장비)
Thèmes clés
- •AI 가속기(H100/B200) 수요 공급 불균형 지속
- •Gate-All-Around 공정 전환 → 장비 교체 사이클
- •HBM3e/HBM4 양산 경쟁 — SK하이닉스·마이크론·삼성
Prochains catalyseurs
- ◆TSMC Q2 실적 (2026.04.17)
- ◆NVIDIA GB300 양산 착수 발표