Amkor Technology

AMKRsupplier

Amkor Technology is one of the world's largest outsourced semiconductor assembly and test (OSAT) providers, offering advanced packaging solutions that are essential for assembling complex AI accelerator and high-performance computing chips.

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產品與營收

產品營收佔比

營收結構 ($6.8B)

靜態數據（加載即時財務…）

Advanced Products (55%)

Mainstream Products (30%)

Test & Other Services (15%)

業務部門構成與主要客戶

產品詳情

Advanced Packaging (FC-BGA, SiP)40%

Flip-chip ball grid array and system-in-package for mobile and HPC

2.5D / 3D Packaging25%

Advanced multi-die packaging for AI accelerators and networking chips

Test Services20%

Wafer probe, final test, and burn-in for automotive and consumer ICs

供應鏈關係

合作夥伴

Taiwan Semiconductor Manufacturing Company

Back-end packaging for TSMC-fabricated wafers

影響: Critical — primary foundry partner

主要客戶

NVIDIA Corporation

Advanced packaging for GPU modules

影響: High — AI chip packaging

Marvell Technology

Packaging for networking ASICs

影響: Medium

宏觀與市場背景

반도체行業新聞

WFE(반도체 장비) 업사이클 + AI HBM 슈퍼사이클 진입

TSMC 가동률

92%+

HBM 수요 성장

+180% YoY

WFE 시장 규모

$105B (2026E)

리드타임 (장비)

18~24개월

近期催化劑

◆TSMC Q2 실적 (2026.04.17)◆NVIDIA GB300 양산 착수 발표◆AMAT/LRCX/KLAC 실적 시즌 (2026.05)

AI 分析

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企業資訊

總部

Tempe, Arizona, USA

成立時間

1968

員工人數

31,000+

官網

amkor.com

行業概況 — 반도체

行業新聞