Amkor Technology

AMKRsupplier

Amkor Technology is one of the world's largest outsourced semiconductor assembly and test (OSAT) providers, offering advanced packaging solutions that are essential for assembling complex AI accelerator and high-performance computing chips.

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产品与营收

产品营收占比

营收构成 ($6.8B)

静态数据（加载实时财务…）

Advanced Products (55%)

Mainstream Products (30%)

Test & Other Services (15%)

业务板块构成与主要客户

产品详情

Advanced Packaging (FC-BGA, SiP)40%

Flip-chip ball grid array and system-in-package for mobile and HPC

2.5D / 3D Packaging25%

Advanced multi-die packaging for AI accelerators and networking chips

Test Services20%

Wafer probe, final test, and burn-in for automotive and consumer ICs

供应链关系

合作伙伴

Taiwan Semiconductor Manufacturing Company

Back-end packaging for TSMC-fabricated wafers

影响: Critical — primary foundry partner

主要客户

NVIDIA Corporation

Advanced packaging for GPU modules

影响: High — AI chip packaging

Marvell Technology

Packaging for networking ASICs

影响: Medium

宏观与市场背景

반도체行业新闻

WFE(반도체 장비) 업사이클 + AI HBM 슈퍼사이클 진입

TSMC 가동률

92%+

HBM 수요 성장

+180% YoY

WFE 시장 규모

$105B (2026E)

리드타임 (장비)

18~24개월

近期催化剂

◆TSMC Q2 실적 (2026.04.17)◆NVIDIA GB300 양산 착수 발표◆AMAT/LRCX/KLAC 실적 시즌 (2026.05)

AI 分析

点击「获取 AI 分析」以获得 Amkor Technology 的 AI 供应链分析。

企业信息

总部

Tempe, Arizona, USA

成立时间

1968

员工人数

31,000+

官网

amkor.com

行业概况 — 반도체

行业新闻