Amkor Technology

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Amkor Technology is one of the world's largest outsourced semiconductor assembly and test (OSAT) providers, offering advanced packaging solutions that are essential for assembling complex AI accelerator and high-performance computing chips.

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Produk & Pendapatan

Pangsa Pendapatan Produk

Komposisi Pendapatan ($6.8B)

Data statis (memuat keuangan langsung…)

Advanced Products (55%)

Mainstream Products (30%)

Test & Other Services (15%)

Komposisi segmen dan pelanggan utama

Detail produk

Advanced Packaging (FC-BGA, SiP)40%

Flip-chip ball grid array and system-in-package for mobile and HPC

2.5D / 3D Packaging25%

Advanced multi-die packaging for AI accelerators and networking chips

Test Services20%

Wafer probe, final test, and burn-in for automotive and consumer ICs

Hubungan Rantai Pasok

Mitra

Taiwan Semiconductor Manufacturing Company

Back-end packaging for TSMC-fabricated wafers

Dampak: Critical — primary foundry partner

Pelanggan Utama

NVIDIA Corporation

Advanced packaging for GPU modules

Dampak: High — AI chip packaging

Marvell Technology

Packaging for networking ASICs

Dampak: Medium

Konteks makro dan pasar

반도체Berita sektor

WFE(반도체 장비) 업사이클 + AI HBM 슈퍼사이클 진입

TSMC 가동률

92%+

HBM 수요 성장

+180% YoY

WFE 시장 규모

$105B (2026E)

리드타임 (장비)

18~24개월

Katalis mendatang

◆TSMC Q2 실적 (2026.04.17)◆NVIDIA GB300 양산 착수 발표◆AMAT/LRCX/KLAC 실적 시즌 (2026.05)

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Info Perusahaan

Kantor Pusat

Tempe, Arizona, USA

Didirikan

1968

Karyawan

31,000+

Situs Web

amkor.com

Gambaran umum sektor — 반도체

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