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ACM Research

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ACM Research makes cutting-edge wafer-cleaning equipment with proprietary SAPS/TEBO technology, capturing significant share in China's domestic semiconductor fabs amid US export-control tailwinds.

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Productos e Ingresos

Participación de Ingresos por Producto

Desglose de Ingresos ($780M)

Datos estáticos (cargando finanzas en tiempo real…)

China (CXMT, YMTC, SMIC) (82%)
Korea & Other (18%)

Composición de segmentos y clientes principales

Detalles del producto

SAPS / TEBO Cleaning Systems72%

Ultra-clean wafer surface preparation using space alternated phase shift (SAPS) and timely energized bubble oscillation (TEBO) technology.

Semi-Critical Cleaning18%

Track-compatible post-etch and post-CMP cleaning tools for less critical applications.

ECP & Other10%

Electrochemical plating (copper) and other advanced packaging process tools.

Contexto macro y de mercado

WFE(반도체 장비) 업사이클 + AI HBM 슈퍼사이클 진입

TSMC 가동률

92%+

HBM 수요 성장

+180% YoY

WFE 시장 규모

$105B (2026E)

리드타임 (장비)

18~24개월

Próximos catalizadores

TSMC Q2 실적 (2026.04.17)NVIDIA GB300 양산 착수 발표AMAT/LRCX/KLAC 실적 시즌 (2026.05)

Últimas noticias

Cargando noticias...

Análisis IA

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Información de la Empresa

Sede Central

Fremont, California, USA

Fundación

1998

Empleados

1,600

Sitio Web

acmrcsh.com

Estado del sector반도체

Noticias del sector

WFE(반도체 장비) 업사이클 + AI HBM 슈퍼사이클 진입

TSMC 가동률

92%+

HBM 수요 성장

+180% YoY

WFE 시장 규모

$105B (2026E)

리드타임 (장비)

18~24개월

Temas clave

  • AI 가속기(H100/B200) 수요 공급 불균형 지속
  • Gate-All-Around 공정 전환 → 장비 교체 사이클
  • HBM3e/HBM4 양산 경쟁 — SK하이닉스·마이크론·삼성

Próximos catalizadores

  • TSMC Q2 실적 (2026.04.17)
  • NVIDIA GB300 양산 착수 발표